Measuring method and semiconductor structure forming method

ABSTRACT

A measuring method is provided. A probe and a first sensor are disposed over a jig including a bar protruding from the jig. The probe is moved until a first surface of the probe is laterally aligned with a second surface of the bar facing the jig. A first distance between the second surface of the bar and the first sensor is obtained by the first sensor. The probe and the first sensor are disposed over a magnetron. Magnetic field intensities at different elevations above the magnetron are measured by the probe. A method for forming a semiconductor structure is also provided.

PRIORITY CLAIM AND CROSS-REFERENCE

This application claims the benefit of provisional application Ser.62/907,985 filed on Sep. 30, 2019, entitled “CALIBRATION OFSEMICONDUCTOR DEPOSITION EQUIPMENT,” the disclosure of which is herebyincorporated by reference in its entirety.

BACKGROUND

With the advancement of electronic technology, semiconductor devices aresteadily becoming smaller in size while providing greater functionalityand including greater amounts of integrated circuitry. Due to theminiaturized scale of the semiconductor device, a number ofsemiconductor components are assembled on the semiconductor device.Furthermore, numerous manufacturing operations are implemented withinsuch a small semiconductor device.

Prior to fabrication of the semiconductor device, calibration of amanufacturing apparatus is performed. Components of the manufacturingapparatus must undergo tuning or adjustment for the purpose offabrication stability and repeatability. The manufacturing operationscan be repeatedly implemented on each of the semiconductor devices, andsemiconductor components can be accurately assembled on thesemiconductor device. However, the calibration of the manufacturingapparatus is dependent on accuracy of data associated with physicalproperties of each component of the manufacturing apparatus (i.e.,dimensions, coefficient of thermal expansion, lifespan, hardness, etc.).As such, maintaining stability of the manufacturing apparatus andmanufacturing repeatability of the semiconductor device may presentchallenges.

Therefore, there is a continuous need to modify and improve thefabrication of the semiconductor device and the manufacturing apparatusfor fabricating the semiconductor device.

BRIEF DESCRIPTION OF THE DRAWINGS

Aspects of the present disclosure are best understood from the followingdetailed description when read with the accompanying figures. It isemphasized that, in accordance with the standard practice in theindustry, various features are not drawn to scale. In fact, thedimensions of the various features may be arbitrarily increased orreduced for clarity of discussion.

FIG. 1 is a schematic diagram of a calibration apparatus in accordancewith some embodiments of the present disclosure.

FIG. 2 is a flowchart of a measuring method in accordance with someembodiments of the present disclosure.

FIGS. 3 to 14 are schematic diagrams illustrating different stages of ameasuring method in accordance with some embodiments of the presentdisclosure.

FIG. 15 is a schematic diagram of a PVD equipment in accordance withsome embodiments of the present disclosure.

FIG. 16 is a schematic diagram of a calibration apparatus in accordancewith some embodiments of the present disclosure.

FIG. 17 is a schematic diagram of a calibration apparatus in accordancewith some embodiments of the present disclosure.

FIG. 18 is a schematic diagram illustrating a reading range of anoptical sensor in accordance with some embodiments of the presentdisclosure.

FIGS. 19 to 21 are schematic diagrams illustrating using only onepressure sensor to perform the methods shown in FIGS. 15 to 17 inaccordance with some embodiments of the present disclosure.

FIGS. 22 to 24 are schematic diagrams illustrating using both pressuresensors to perform the methods shown in FIGS. 15 to 17 in accordancewith some embodiments of the present disclosure.

FIGS. 25 to 27 are schematic diagrams illustrating using an opticalsensor and a pressure sensor to perform the methods shown in FIGS. 15 to17 in accordance with some embodiments of the present disclosure.

FIGS. 28 to 29 are schematic diagrams illustrating using a pressuresensor and an optical sensor in accordance with some embodiments of thepresent disclosure.

DETAILED DESCRIPTION OF THE DISCLOSURE

The following disclosure provides many different embodiments, orexamples, for implementing different features of the provided subjectmatter. Specific examples of elements and arrangements are describedbelow to simplify the present disclosure. These are, of course, merelyexamples and are not intended to be limiting. For example, the formationof a first feature over or on a second feature in the description thatfollows may include embodiments in which the first and second featuresare formed in direct contact, and may also include embodiments in whichadditional features may be formed between the first and second features,such that the first and second features may not be in direct contact. Inaddition, the present disclosure may repeat reference numerals and/orletters in the various examples. This repetition is for the purpose ofsimplicity and clarity and does not in itself dictate a relationshipbetween the various embodiments and/or configurations discussed.

Further, spatially relative terms, such as “beneath,” “below,” “lower,”“above,” “over,” “upper,” “on” and the like, may be used herein for easeof description to describe one element or feature's relationship toanother element(s) or feature(s) as illustrated in the figures. Thespatially relative terms are intended to encompass differentorientations of the device in use or operation in addition to theorientation depicted in the figures. The apparatus may be otherwiseoriented (rotated 90 degrees or at other orientations) and the spatiallyrelative descriptors used herein may likewise be interpretedaccordingly.

As used herein, although the terms such as “first,” “second” and “third”describe various elements, components, regions, layers and/or sections,these elements, components, regions, layers and/or sections should notbe limited by these terms. These terms may be only used to distinguishone element, component, region, layer or section from another. The termssuch as “first,” “second” and “third” when used herein do not imply asequence or order unless clearly indicated by the context.

Notwithstanding that the numerical ranges and parameters setting forththe broad scope of the disclosure are approximations, the numericalvalues set forth in the specific examples are reported as precisely aspossible. Any numerical value, however, inherently contains certainerrors necessarily resulting from the standard deviation found in therespective testing measurements. Also, as used herein, the terms“substantially,” “approximately” and “about” generally mean within avalue or range that can be contemplated by people having ordinary skillin the art. Alternatively, the terms “substantially,” “approximately”and “about” mean within an acceptable standard error of the mean whenconsidered by one of ordinary skill in the art. People having ordinaryskill in the art can understand that the acceptable standard error mayvary according to different technologies. Other than in theoperating/working examples, or unless otherwise expressly specified, allof the numerical ranges, amounts, values and percentages such as thosefor quantities of materials, durations of times, temperatures, operatingconditions, ratios of amounts, and the likes thereof disclosed hereinshould be understood as modified in all instances by the terms“substantially,” “approximately” or “about.” Accordingly, unlessindicated to the contrary, the numerical parameters set forth in thepresent disclosure and attached claims are approximations that can varyas desired. At the very least, each numerical parameter should at leastbe construed in light of the number of reported significant digits andby applying ordinary rounding techniques. Ranges can be expressed hereinas from one endpoint to another endpoint or between two endpoints. Allranges disclosed herein are inclusive of the endpoints, unless specifiedotherwise.

The disclosure relates to a method of calibrating semiconductorequipment, such as physical vapor deposition (PVD) equipment. The PAIDequipment is widely used in thin-film deposition in the process ofsemiconductor manufacturing. The performance of the PVD equipment isclosely related to two major components of the PVD equipment, i.e., themagnetron and the target. A magnetic field generated by the magnetronand formed around the surface of the target plays an important role inthe deposition operation. The magnetic field is measured using amagnetic sensor, and it is necessary to maintain a distance between themagnetron and the target during the deposition operation in order toapply a required strength of the magnetic field on the target. Thedistance between the magnetron and the target may vary according todifferent deposition applications, and therefore manual inspection andcalibration of the distance must be performed on the chamber before aPVD task is performed. However, the manual calibration of the magnetronmay not provide sufficient efficiency and accuracy when the magnetron isoff the chamber. Therefore, the deposition performance may be degraded.

The above issues can be addressed by implementing a calibration method.The calibration method may include mapping positions of a sensorrelative to a surface of the magnetron, obtaining several parameters(e,g. magnetic fields across the surface of the magnetron, distancesbetween the sensor and the magnetron, etc.) over the magnetron by thesensor, recording those parameters and modelling a film production (e.g.magnetic fields at different elevations above and across the surface ofthe magnetron, etc.) based on the parameters, and selecting a suitableelevation above the magnetron based the modelling results in order toachieve desired film characteristics during the film production.

In some embodiments, a calibration method includes mapping positions ofa sensor relative to a surface of a circular magnetron using a polarcoordinate system, measuring magnetic fields at different elevationsabove and across the surface of the circular magnetron, and selecting asuitable elevation above the circular magnetron based on themeasurements, and then installing the circular magnetron inside a PVDchamber based on the selected elevation.

In some embodiments, a calibration or measuring method is provided toautomatically detect a minimum distance of a magnetic sensor from amagnetron, measure a magnetic intensity at different elevations abovethe magnetron, and record the magnetic intensity and distance at thedifferent elevations above a top surface of the magnetron. The recordeddistances are used as a reference to determine an approximate size of agap between the magnetron and the target. An artificial intelligence(AI) data training scheme may be incorporated into the calibration, inwhich the inspection performance of the magnetic sensor using an opticalsensor or a pressure sensor can be improved through the AI data trainingapproach. The data repeatability and accuracy of the measuring resultcan be enhanced accordingly.

FIG. 1 is a schematic diagram of a calibration apparatus 100 inaccordance with some embodiments of the present disclosure. Thecalibration apparatus 100 includes a jig 101, having a reference bar 102and a first sensor 103 installed thereon. The reference bar 102protrudes from the jig 101. In some embodiments, the first sensor 103also protrudes from the jig 101. In some embodiments, the jig 101 can bea plate for holding the first sensor 103 and the reference bar 102. Insome embodiments, the jig 101 can be a metal plate. In some embodiments,the reference bar 102 is a metal rod installed on the jig 101. In someembodiments, the first sensor 103 is installed within the jig 101 andhas a top surface 103 a. In some embodiments, the first sensor 103 hasan upward-facing sensing direction. In some embodiments, the firstsensor 103 includes one or more types of sensors. In some embodiments,the first sensor 103 may include an optical sensor, a pressure sensor,or other suitable types of sensors. A configuration of the reference bar102 can be adjusted according to different applications. In theembodiments shown in FIG. 1, the reference bar 102 is a straight bar;however, it is not limited thereto. In other embodiments, the referencebar 102 can be a rounded protrusion or a top surface 102 a in a domeshape.

The calibration apparatus 100 also includes a carrier 111, a measuringtool 112 and a second sensor 113. In some embodiments, the measuringtool 112 and the second sensor 113 are installed on the carrier 111. Insome embodiment, the carrier 111, the measuring tool 112 and the secondsensor 113 are disposed over the jig 101. In some embodiments, thecarrier 111 can be a metal plate extending along a first direction Z asshown in FIG. 1. In some embodiments, the second sensor 113 includes oneor more types of sensors. In some embodiments, the second sensor 113includes one or more of an optical sensor and a pressure sensor.

In some embodiments, the measuring tool 112 is configured to measure amagnetic field intensity. In some embodiments, the measuring tool 112includes a probe 112 a protruding from the measuring tool 112. In someembodiments, the probe 112 a can be any type of magnetic field probesuch as Gauss probe or the like. In some embodiments, the probe 112 aprotrudes from the carrier 111 along the first direction Z. In otherwords, the probe 112 a protrudes from the carrier 111 toward the jig101. In some embodiments, a lower surface 113 a of the second sensor 113is substantially coplanar with a lower surface 111 a of the carrier 111.In some embodiments, the second sensor 113 is entirely disposed withinthe carrier 111.

The calibration apparatus 100 includes one or more motors. Asillustrated in FIG. 1, the one or more motors include a first motor 121,a second motor 122, and a third motor 123. The first motor 121 isconfigured to move the carrier 111, the measuring tool 112 and thesecond sensor 113 along a second direction Y. The second motor 122 isconfigured to move the carrier 111, the measuring tool 112 and thesecond sensor 113 along a third direction X. The third motor 123 isconfigured to move the carrier 111, the measuring tool 112 and thesecond sensor 113 along the first direction Z. Thus, the carrier 111,the measuring tool 112 and the second sensor 113 can be moved togetheralong the first direction Z, the second direction Y or the thirddirection X. In some embodiments, the first motor 121, the second motor122 and the third motor 123 are directly or indirectly connected to thecarrier 111. In the embodiment shown in FIG. 1, the carrier 111 isdirectly connected to the second motor 122, while indirectly connectedto the first motor 121 and the third motor 123.

The disclosure is not limited to above. In other embodiments, thecarrier 111 can be omitted. Therefore, the measuring tool 112 and thesecond sensor 113 are movable individually along the first direction Z,the second direction Y and the third direction X. In some embodiments, aposition or movement of the measuring tool 112 and the second sensor 113can be individually controlled. In some embodiments, the measuring tool112 and the second sensor 113 can be moved independently along thesecond direction Y by the first motor 121. In some embodiments, themeasuring tool 112 and the second sensor 113 can be moved independentlyalong the third direction X by the second motor 122. In someembodiments, the measuring tool 112 and the second sensor 113 can bemoved independently along the first direction by the third motor 123. Insome embodiments, a fourth motor 124 is installed on the carrier 111 tocontrol the movement of the second sensor 113, independent from thecarrier 111 and the measuring tool 112.

In some embodiments, the calibration apparatus 100 also includes a userinterface for an operator to control the movement of the carrier 111,the measuring tool 112 and the second sensor 113. In some embodiments,the calibration apparatus 100 includes a central processing unit (CPU).A first instruction from the user interface is sent to the CPU and theCPU generates a second instruction configured to control movements ofthe carrier 111, the measuring tool 112 and the second sensor 113. Insome embodiments, the second instruction is transmitted to the firstmotor 121, the second motor 122, the third motor 123 and/or the fourthmotor 124. In some embodiments, the calibration apparatus 100 mayinclude a software configured to communicate with the first sensor 103and the second sensor 113. The software can integrate the hardware(including, for instance, the carrier 111, the measuring tool 112, thesecond sensor 113, the first motor 121, the second motor 122, the thirdmotor 123, etc.) of the calibration apparatus 100 to perform a measuringor calibration method. In some embodiments, the software is used tocontrol those hardware movements. send commands to the hardware, readand determine positions of the hardware, obtain measurements, loadexperimental parameters, and/or collect data automatically.

The disclosure also provides a method of using the calibration apparatus100 for measuring magnetic field intensities of a magnetron at differentelevations above a top surface of the magnetron. The differentelevations are correlated with the magnetic field intensities from themagnetron. The method can obtain an optimum height above the top surfaceof the magnetron. A magnetic field distribution at the optimum height isin optimal. After obtaining the optimum height by the method, a distancebetween the magnetron and a target can be maintained in an optimalduring PVD operation with reference to the optimum height. Therefore, afilm disposed on a substrate with good uniformity can be obtained bysuch PVD operation.

In some embodiments of the present disclosure, a measuring method 300 isprovided. The measuring method 300 includes several operations 301 to304 as shown in FIG. 2. FIGS. 3 to 14 are schematic diagramsillustrating the jig 101, the reference bar 102, the first sensor 103,the carrier 111, the measuring tool 112 and the second sensor 113 atdifferent stages of the method. In addition, for purposes ofillustration, embodiments that include an optical sensor as the firstsensor 103 and an optical sensor as the second sensor 113 areillustrated in FIGS. 3 to 14 and the following description, but thedisclosure is not limited herein.

In some embodiments, the operation 301 includes several stages as shownin FIGS. 3-6. In the operation 301, a probe 112 a is moved until a lowersurface 112 b of the probe 112 a is laterally aligned with a top surface102 a of a bar 102 protruding from a jig 101 as shown in FIG. 6.Referring to FIG. 3, the jig 101 and the carrier 111 are provided orreceived. In some embodiments, the reference bar 12 and the first sensor103 are installed on and protruded from the jig 101. In someembodiments, the measuring tool 112 and the second sensor 113 areinstalled on the carrier 111. In some embodiments, the probe 112 a ofthe measuring tool 112 protrudes from the carrier 111.

Referring to FIG. 4, the carrier 111 moves over and toward the jig 101,in some embodiments, the measuring tool 112 is disposed above the firstsensor 103, and the second sensor 113 is disposed above the referencebar 102. In some embodiments, the probe 112 a is disposed above the topsurface 103 a of the first sensor 103, and the lower surface 113 a ofthe second sensor 113 is disposed above the top surface 102 a of thereference bar 102. In some embodiments, the measuring tool 112 isvertically aligned with the first sensor 103, and the second sensor 113is vertically aligned with the reference bar 102. In some embodiments,the carrier 111 is moved manually (e.g. by an operator) or automatically(e.g by motors with controllers) over the jig 101.

In some embodiments, the first sensor 103 is configured to detect andlocate the probe 112 a. Once the probe 112 a is located by the firstsensor 103, the probe 112 a or the carrier 111 is stopped over the firstsensor 103. In some embodiments, the first sensor 103 sends signals tothe CPU, and when the probe 112 a enters a detection range of the firstsensor 103, the CPU instructs and stops the first motor 121, the secondmotor 122 and the third motor 123. In some embodiments, the secondsensor 113 is moved individually, and can detect and locate thereference bar 102. In some embodiments, the second sensor 113 is stoppedwhen it is vertically aligned with the reference bar 102.

Referring to FIG. 5, the carrier 111 is moved toward the jig 101. Insome embodiments, the carrier 111 moves vertically toward the jig 101.Referring to FIG. 6, as the carrier 111 moves toward the jig 101, thelower surface 112 b of the probe 112 a becomes substantially coplanarwith the top surface 102 a of the reference bar 102. The carrier 111 ismoved vertically over the jig 101 until the lower surface 112 b of theprobe 112 is at a same level as the top surface 102 a of the referencebar 102. The dashed line in FIG. 6 represents an extension of the topsurface 102 a of the reference bar 102 for a purpose of illustration. Insome embodiments, the carrier 111 stops when the lower surface 112 b ofthe probe 112 a is laterally aligned with or coplanar with the topsurface 102 a of the reference bar 102. The lower surface 112 b of theprobe 112 faces the jig 101. In some embodiments, the lower surface 112b may be not a planar surface, but a rounded surface. In someembodiments, the top surface 102 a of the reference bar 102 faces thesecond sensor 113. In some embodiments, the top surface 102 a of thereference bar 102 is designed to be a planar surface, but the disclosureis not limited thereto.

In some embodiments, the carrier 111 keeps moving toward the jig 101 andit is possible for the lower surface 112 b of the probe 112 a to belower than the top surface 102 a of the reference bar 102 as shown inFIG. 7. The first sensor 103 detects that the lower surface 112 b of theprobe 112 a is lower than the top surface 102 a of the reference bar102, and a signal is sent to the CPU in order to control the third motor123 to move the carrier 111 upward until the lower surface 112 b of theprobe 112 a is coplanar with the top surface 102 a of the reference bar102 as shown in FIG. 6.

In order to accurately detect that the lower surface 112 b of the probe112 a is coplanar with the top surface 102 a of the reference bar 102, aheight difference H between the top surface 103 a of the first sensor103 and the top surface 102 a of the reference bar 102 is designeddepending on a reading range of the first sensor 103.

Referring to FIG. 8, in accordance with some embodiments for a purposeof illustration, a center reading 131 is defined. The center reading 131is a central position of a reading range 132 of the first sensor 103.The center reading 131 is at a half of the reading range 132. In someembodiments, the reading range 132 is about 200 mm. In some embodiments,the center reading 131 is located at a position about 100 mm away fromthe lower surface 112 b of the probe 112. In some embodiments, thecenter reading C of the first sensor 103 is also referred to as a zeroreading. In some embodiments, a first position 133 and a second position134 are defined. In some embodiments, the first position 133 is locatedat a position about Y mm from the center reading 131 towards the firstsensor 103, and the second position 134 is located at a position about Ymm from the center reading 131 and away from the first sensor 103. Insome embodiments, Y is a number greater than zero.

When a distance between a position P1 and the first sensor 103 is equalto the center reading 131, then a reading of the first sensor 103 iszero, which can then be calculated or translated as the half of thereading range 132 (e.g. 100 mm). When a position P2 is lower than theposition P1 and within the reading range 132 of the first sensor 103,then a reading of the first sensor 103 is a negative value, which canthen be calculated into a distance between the first sensor 103 and theposition P2 greater than the half of the reading range 132. Similarly,when a position P3 is higher than the position P1 and within the readingrange 132 of the first sensor 103, then a reading of the first sensor103 to the position P3 is a positive value, which can then be used tocalculate a distance between the first sensor 103 and the position P3being less than the half of the reading range 132. When a position P4 ishigher than the position P1 and the first position 133, then a distancebetween the position P4 and the first sensor 103 is not available.Similarly, when a position P5 is lower than the position P1 and thesecond position 134, then a distance between the position P4 and thefirst sensor 103 is not available. It should be noted that the centerreading 131 and the reading range 132 can be adjusted depending ondifferent applications and a specification of the first sensor 103, andit is not limited herein.

Referring back to FIG. 6, the height difference H between the topsurface 103 a of the first sensor 103 and the top surface 102 a of thereference bar 102 is designed to be within the reading range 132 of thefirst sensor 103. The first sensor 103 is able to detect that the lowersurface 112 b of the probe 112 a is coplanar with the top surface 102 aof the reference bar 102. In some embodiments, for purposes of detectionand ease of calculation, the height different H is designed to besubstantially equal to the center reading 131 of the first sensor 103.In some embodiments, the top surface 102 a of the reference bar 102 isinitially defined to be a zero reading of the first sensor 103.

In some embodiments, the operation 302 is implemented as shown in FIG.6. In the operation 302, a distance D1 between the second sensor 113 andthe top surface 102 a of the reference bar 102 is obtained or recordedby the second sensor 113 as a reference reading when the lower surface112 a of the probe 112 is coplanar with the top surface 102 a of thereference bar 102. In some embodiments, the operation 302 is implementedafter the operation 301.

Referring to FIG. 9, in the subsequent operation of the measuringmethod, in order to ensure that the probe 112 a does not touch a topsurface of the magnetron during the measurement, the carrier 111 ismoved upwardly away from the jig 101 by a default distance D2. In someembodiments, the default distance D2 can be equal to 0.5 cm, 1 cm or 2cm. In some embodiments, the default distance D2 is less than 5 cm. Thedefault distance D2 can ensure the probe 112 a would not harm themagnetron during the calibration. In the embodiments, a distance D3between the top surface 102 a of the reference bar 102 and the secondsensor 113 is obtained or recorded by the second sensor 113 after thecarrier 111 is moved upwardly away from the jig 101 by the defaultdistance D2. In some embodiments, the distance D3 is equal to a total ofthe default distance D2 and the distance D1.

In some embodiments, the operation 303 includes several stages as shownin FIGS. 10-11. In the operation 303, the probe 112 a and the secondsensor 113 are disposed over a magnetron 141 as shown in FIG. 11.Referring to FIGS. 10 to 11, the carrier 111, the measuring tool 112 andthe second sensor 113 move toward and are disposed above the magnetron141. In some embodiments, the carrier III is moved by the first motor121, the second motor 122 and the third motor 123. In some embodiments,the probe 112 a is disposed at a position over the magnetron 141 andadjacent to a center of a top surface 141 a of the magnetron 141. Insome embodiments, the center of the top surface 141 a of the magnetron141 is obtained based on any suitable method before the operation 303,such that the probe 112 a is disposed over and substantially verticallyaligned with the center of the top surface 141 a of the magnetron 141,wherein the top surface 141 a faces the carrier 111. In someembodiments, when the carrier 111 is disposed over the top surface 141 aof the magnetron 141, a distance between the second sensor 113 and thetop surface 141 a of the magnetron 141 is greater than the distance D1.In some embodiments, the second sensor 113 is disposed away from the topsurface 141 a of the magnetron 141 according to a result obtained fromthe operation 302.

Referring to FIG, 12, the lower surface 112 b of the probe 112 a isbrought to a desired level above the magnetron 141 based on the distanceD1 recorded by the second sensor 113 as the reference reading. Thecarrier 111 is moved downward by the first motor 121, the second motor122 and the third motor 131 toward the top surface 141 a of themagnetron 141 until a distance between the top surface 141 a of themagnetron 141 and the second sensor 113 is substantially equal to thedistance D1. In the embodiments shown in FIG. 12, the lower surface 112b is vertically above and separated from the top surface 141 a of themagnetron 141 by the distance D1. In some alternative embodiments, thelower surface 112 b of the probe 112 a is directly on the top surface141 a of the magnetron 141.

In some embodiments, the operation 304 is implemented as shown in FIG.14. In the operation 304, magnetic field intensities at differentelevations above the magnetron 141 are measured by the probe 112 a.Referring to FIGS. 13 to 14, a power is supplied to operate themagnetron 141, and magnetic field is generated by the magnetron 141. Assuch, magnetic field intensities at different elevations above themagnetron 141 are measured by the measuring tool 112 through the probe112 a. The carrier 111 with the probe 112 a and the second sensor 113 ismoved upward away from the top surface 141 a of the magnetron 141 in aninterval D′ to measure the magnetic field intensities. The magneticfield intensities of the magnetron 141 at sequential increments of theinterval D′ in the upward direction over the magnetron 141 can beobtained. The interval D′ is not limited herein, and can be adjusted asrequired. As shown in FIG. 13, the carrier 111 is moved vertically awayfrom the top surface 141 a of the magnetron 141. When the second sensor113 is separated from the top surface 141 a by the distance equal to theinterval D′, a first magnetic field intensity is measured when the probe112 a is at the position shown in FIG. 13. Next, the carrier 111continues to move farther away from the magnetron 141. In someembodiments, the carrier 111 is moved vertically farther away from thetop surface 141 a of the magnetron 141 by two times of the interval D′,as shown in FIG. 14. A second magnetic field intensity is measured whenthe probe 112 a is at the position shown in FIG. 14.

A correlation of the magnetic field intensities at different elevationsover the top surface 141 a of the magnetron 141 can be obtained by themeasuring method illustrated above. The magnetron 141 can then beinstalled over a target in a PVD equipment.

FIG. 15 is a schematic diagram of a PVD equipment 200 in accordance withsome embodiments of the present disclosure. The PVD equipment 200includes a chamber 201, a target 202 and a pedestal 203. The chamber 201includes a plasma region A indicated by a dashed circle illustrating theregion of plasma during a PVD operation. The target 202 is a sputteringtarget installed in the chamber 201 and configured to provide materialof a PVD film to be formed on a substrate 204. The pedestal 203 is alsodisposed in the chamber 201 and configured to hold the substrate 204thereon. The magnetron 141 is installed over the target 202 after themeasuring method is performed. An optimum distance D is defined betweenthe magnetron 141 and the target 202.

According to the correlation of the magnetic field intensities atdifferent elevations above the top surface 141 a of the magnetron 141obtained by the measuring method, the optimum distance D can bedetermined. The optimum distance D having a better uniformity result isused in the mass production. Therefore, the measuring method of thepresent disclosure can provide mathematical correlation between theoptimum distance and the uniformity of the PVD film, and a fabricationconsistency and repeatability can be improved.

In the embodiments described above, both the first sensor 103 and thesecond sensor 113 are optical sensors, and the method 300 can beautomatically performed as shown in FIGS. 16 and 17. As illustrationabove, according to some embodiments of the present disclosure, acontroller 205 is configured to actuate and coordinate the motors 121,122, 123 to control movement of the carrier 111, and the softwareincludes a first algorithm to communicate with the first senor 103 andthe second sensor 113 and control the first motor 121, the second motor122 and the third motor 133 to find the optimum distance D. The probe112 a is then moved over and around the center of the magnetron 141using a second algorithm of the software as shown in FIG. 17. The secondalgorithm also ensures electron beams of the second sensor 113 fall onthe top surface 141 a of the magnetron 141. However, the presentdisclosure is not limited thereto the embodiments as illustrated aboveand in FIGS. 3 to 14. In some alternative embodiments, the first sensor103 and the second sensor 113 can include one or more pressure sensors.The method 300 can also be applied to the embodiments using a pressuresensor as the first sensor 103 and/or the second sensor 113.

Referring to FIGS. 18 to 19, in accordance with some embodiments, thesecond sensor 113 is a pressure sensor, and no first sensor 103 isinstalled on the jig 101. In the embodiments, a protrusion 112 c of theprobe 112 a from the carrier 111 is designed to be less than aprotrusion 113 b of the second sensor 113 from the carrier 111 as shownin FIG. 18. After the second sensor 113 is disposed over the referencebar 102, the second sensor 113 is moved toward the reference bar 102 bythe third motor 123 until the second sensor 113 contacting the referencebar 102 is detected by the second sensor 113 as shown in FIG. 19.

In some embodiments, the second sensor 113 is disposed over and alignedwith the reference bar 102 manually by an operator controlling the firstmotor 121, the second motor 122 and the third motor 123. In someembodiments, a location of the reference bar 102 is stored in thesoftware of the calibration apparatus 100, and the second sensor 113 canbe automatically disposed over and aligned with the reference bar 102.Therefore, in the embodiments illustrated in FIGS. 18 to 19, the method300 can be performed semi-automatically or automatically.

Referring to FIGS. 20 to 21, the carrier 111 including the probe 112 aand the second sensor 113 is moved over a center of the top surface 141a of the magnetron 141 as shown in FIG. 19. The carrier 111 is thenmoved toward the magnetron 141 by the third motor 33 until the secondsensor 113 detects contact between the magnetron 141 and the secondsensor 113. The magnetic field intensities of the magnetron 141 atdifferent elevations are then measured by moving the carrier 111 upwardin sequential increments equal to a predetermined interval.

Referring to FIGS. 22 to 24, in accordance with some embodiments, boththe first sensor 103 and the second sensor 113 are pressure sensors. Thefourth motor 124 is disposed on the carrier 111 having a track tocontrol an elevation of the second sensor 113. In the embodiments, thethird motor 123 is controlled to move the probe 112 a vertically. Insome embodiments, the probe 112 a is moved over the first sensor 103manually prior to the probe 112 a contacting with the first sensor 13.In some embodiments, a location of the first sensor 103 is stored in thesoftware, and the probe 112 a can be moved automatically to verticallyalign with the first sensor 13. In some embodiments, the first sensor103 can locate the probe 112 a once the lower surface 112 b of the probe112 a contacting with the first sensor 103 is detected by the firstsensor 103 as shown in FIG. 22.

After locating the probe 112 a, the second sensor 113 is moved downwardby the fourth motor 124 to detect the top surface 102 a of the referencebar 102 as shown in FIG. 23. The second sensor 113 records that adistance between the reference bar 102 and the carrier 111 is equal tothe protrusion 113 b of the second sensor 113. It should be noted that,in the embodiments, a protrusion 113 b of the second sensor 113 as shownin FIG. 22 before the detection of the reference bar 102 is less thanthe protrusion 112 c of the probe 112 a as shown in FIG. 23.

In some embodiments using a pressure sensor for the first sensor 103, aheight of the reference bar 102 is designed to be substantially equal toa height of the first sensor 103. The carrier 111 is then moved over themagnetron 141 for measurement of the magnetic field intensities atdifferent elevations as shown in FIG. 24. In sonic embodiments, in orderto ensure no contact of the probe 112 a and the magnetron 141 for apurpose of avoiding damage, the second sensor 113 is moved fartherdownward to have the protrusion 113 b greater than the protrusion 112 cbefore the second sensor 113 contacting the top surface 141 a of themagnetron 141. The second sensor 113 is then moved toward the magnetron141 until the second sensor 113 contacting with the magnetron 141detected by the second sensor 113. The magnetic field intensities of themagnetron 141 at different elevations are then measured by moving thecarrier 111 upward in sequential increments equal to a predeterminedinterval. Therefore, in the embodiments illustrated in FIGS. 22 to 24,the method 300 can be performed semi-automatically or automatically.

Referring to FIGS. 25 to 27, in accordance with some embodiments, thefirst sensor 103 is an optical sensor and the second sensor 113 is apressure sensor. In the embodiments, the first sensor 103 is similar tothe first sensor 103 as illustrated in FIGS. 3 to 14 and described inrelevant paragraphs above. The first sensor 103 is configured to locatethe probe 112 a and detect the lower surface 112 b of the probe 112 whenthe lower surface 112 b is coplanar with the top surface 102 a of thereference bar 102. The fourth motor 124 is disposed on the carrier 111having the track to control an elevation of the second sensor 113. Thesecond sensor 113 in the embodiments is similar to the second sensor 113as illustrated in FIGS. 22 to 24. The second sensor 113 is configured todetect a distance between the carrier 111 and the reference bar 102,wherein the protrusion 113 b of the second sensor 113 from the carrier111 is controlled by the fourth motor 124 and may be different indifferent stages of the method 300.

As shown in FIG. 26, the protrusion 113 b of the second sensor 113 isfor recording the distance between the carrier 111 and the top surface102 a of the reference bar 102 when the lower surface 112 b is coplanarwith the top surface 102 a. As shown in FIG. 27, the protrusion 113 bgreater than the protrusion 112 c is used to detect the top surface 141a of the magnetron 141 to ensure the probe 112 b is separated from themagnetron 141. The magnetic field intensities of the magnetron 141 atdifferent elevations are then be measured by moving the carrier 111upward every predetermined interval. Therefore, in the embodimentsillustrated in FIGS. 25 to 27, the method 300 can be performedautomatically.

Referring to FIGS. 28 to 29, in accordance with some embodiments, thefirst sensor 103 is a pressure sensor and the second sensor 113 is anoptical sensor. The function and procedure of the using of the firstsensor 103 to detect the lower surface 112 b of the probe 112 are asillustrated in FIG. 22 and above relevant paragraphs. The function andprocedure of the using of the second sensor 113 to determine thedistance D1 and bring the probe 112 a to a desired level above themagnetron 141 are as illustrated in FIGS. 3 to 14 and described inrelevant paragraphs above. After the first sensor 103 detects the lowersurface 112 b of the probe 112, the distance D1 is recorded by thesecond sensor 113. As shown in FIG. 28, in some embodiments, thedistance D1 is recorded without an additional gap. As shown in FIG. 29,in some embodiments, a reading is recorded after adding the additionalgap. Therefore, in the embodiments illustrated in FIGS. 28 to 29, themethod 300 can be performed semi-automatically or automatically.

Some embodiments of the present disclosure provide a measuring method.The method includes several operations. A probe and a first sensor aredisposed over a jig including a bar protruding from the jig. The probeis moved until a first surface of the probe is laterally aligned with asecond surface of the bar facing the jig. A first distance between thesecond surface of the bar and the first sensor is obtained by the firstsensor. The probe and the first sensor are disposed over a magnetron.Magnetic field intensities at different elevations above the magnetronare measured by the probe.

Some embodiments of the present disclosure provide a measuring method.The method includes several operations. A jig including a first sensorand a reference bar installed on the jig is provided. A carrier is movedover the jig, wherein a second sensor and a probe are installed on thecarrier. The probe and the reference bar are aligned with the firstsensor and the second sensor respectively. A lower surface of the probeis detected by the first sensor. A distance between the second sensorand the reference bar is recorded by the second sensor. The carrier ismoved toward a magnetron. The lower surface of the probe is brought to adesired level above the magnetron based on the distance recorded by thesecond sensor. The probe is moved in an upward direction to measuremagnetic field intensities of the magnetron at different elevations.

Some embodiments of the present disclosure provide an apparatus forcalibration. The apparatus includes a bar and a first sensor protrudedfrom and installed on a jig; a probe and a second sensor installed on acarrier and disposed over the first sensor and the bar; a motorconfigured to control movement of the carrier; and a controllerelectrically connected and configured to control the motor, wherein thecarrier is movable over and toward the jig by the motor to align theprobe and the second sensor with the first sensor and the barrespectively.

The foregoing outlines features of several embodiments so that thoseskilled in the art may better understand the aspects of the presentdisclosure. Those skilled in the art should appreciate that they mayreadily use the present disclosure as a basis for designing or modifyingother processes and structures for carrying out the same purposes and/orachieving the same advantages of the embodiments introduced herein.Those skilled in the art should also realize that such equivalentconstructions do not depart from the spirit and scope of the presentdisclosure, and that they may make various changes, substitutions, andalterations herein without departing from the spirit and scope of thepresent disclosure.

1. A measuring method, comprising: disposing a probe and a first sensorover a jig including a bar protruding from the jig; moving the probeuntil a first surface of the probe is laterally aligned with a secondsurface of the bar facing the jig; obtaining a first distance betweenthe second surface of the bar and the first sensor by the first sensor;disposing the probe and the first sensor over a magnetron; and measuringmagnetic field intensities at different elevations above the magnetronby the probe.
 2. The measuring method of claim 1, wherein after thedisposing of the probe and the first sensor over the magnetron, adistance between the magnetron and the first sensor is substantiallyequal to the first distance.
 3. The measuring method of claim 1, furthercomprising: moving the probe and the first sensor away from the bar by asecond distance, prior to the obtaining of the first distance.
 4. Themeasuring method of claim 3, wherein after the disposing of the probeand the first sensor over the magnetron, a distance between themagnetron and the probe is substantially equal to the second distance.5. The measuring method of claim 1, wherein the probe and the firstsensor are connected to one or more motors, and the disposing of theprobe and the first sensor over the jig includes moving the probe andthe first sensor by the one or more motors.
 6. The measuring method ofclaim 5, wherein the disposing of the probe and the first sensorincludes operating a first motor and a second motor of the one or moremotors to move the probe and the first sensor horizontally, and themoving of the probe includes operating a third motor of the one or moremotors to move the probe vertically.
 7. The measuring method of claim 1,wherein the moving of the probe comprises: moving the probe in avertical direction; detecting the first surface of the probe by a secondsensor installed adjacent to the bar; and stopping the probe when thefirst surface of the probe is laterally aligned with the second surfaceof the bar according to the detection of the second sensor.
 8. Themeasuring method of claim 1, wherein the probe and the first sensor areinstalled on a carrier, and the disposing of the probe and the firstsensor over the jig includes: moving the carrier over the jig to disposethe first sensor over the bar.
 9. The measuring method of claim 1,wherein the disposing of the probe and the first sensor over themagnetron comprises moving the first sensor over a center of themagnetron.
 10. A measuring method, comprising: providing a jig includinga first sensor and a reference bar installed on the jig; moving acarrier over the jig, wherein a second sensor and a probe are installedon the carrier; aligning the probe and the reference bar with the firstsensor and the second sensor respectively; detecting a lower surface ofthe probe by the first sensor; recording a distance between the secondsensor and the reference bar by the second sensor; moving the carrierover a magnetron; bringing the probe toward the magnetron based on thedistance recorded by the second sensor; and moving the probe in anupward direction to measure magnetic field intensities of the magnetronat different elevations.
 11. The measuring method of claim 10, furthercomprising: defining a distance from the first sensor as a zero readingof the first sensor prior to the moving of the carrier over the jig. 12.The measuring method of claim 11, wherein a height difference betweenthe first sensor and the reference bar is substantially equal to thezero reading of the first sensor.
 13. The measuring method of claim 10,wherein the bringing of the probe toward the magnetron comprises:detecting a distance between the second sensor and a top surface of themagnetron by the second sensor; and moving the carrier toward the topsurface of the magnetron until the distance between the second sensorand the top surface of the magnetron is substantially equal to thedistance recorded by the second sensor.
 14. The measuring method ofclaim 10, wherein the probe is brought to a desired level above the topsurface of the magnetron without touching the top surface of themagnetron.
 15. The measuring method of claim 10, further comprising:correlating the magnetic field intensities of the magnetron with thedifferent elevations, wherein distances between the magnetron and thelower surface of the probe are recorded by the second sensor.
 16. Anapparatus for calibration, comprising: a bar and a first sensorprotruded from and installed on a jig; a probe and a second sensorinstalled on a carrier and disposed over the first sensor and the bar; amotor configured to control movement of the carrier; and a controllerelectrically connected and configured to control the motor, wherein thecarrier is movable over and toward the jig by the motor to align theprobe and the second sensor with the first sensor and the barrespectively.
 17. The apparatus of claim 16, wherein the probe protrudesfrom the carrier.
 18. The apparatus of claim 16, wherein a lower surfaceof the second sensor is substantially coplanar with a lower surface ofthe carrier.
 19. The apparatus of claim 16, wherein the carrier ismovable above the jig and along a direction substantially orthogonal toa top surface of the bar.
 20. The apparatus of claim 16, wherein theprobe is configured to measure a magnetic field intensity.